Humboldt-Universität zu Berlin - Faculty of Mathematics and Natural Sciences - Strukturforschung / Elektronenmikroskopie

Instrumentation

Transmission Electron Microscopes
STEM Nion HERMES 200 kV monochromated and aberration-corrected
Nion HERMES 200 kV w/ side entry stage
  • 200 kV, field emission gun
  • monochromated (energy resolution < 6 meV)
  • aberration-corrected (probe size at 200 kV < 0.07 nm)
  • side entry stage (double-tilt cryo holder with electrical contacts, etc.)
  • direct detector for EELS and zero-loss filtered diffraction (Dectris)
  • sample in ultra-high vacuum
 
TEM/STEM JEOL JEM2200FS

(click on image to enlarge)
  • 200 kV, field emission gun
  • UHR pole piece
  • 1k slow-scan CCD camera (Gatan)
  • ASTAR system (NanoMegas) including Beam precession unit, SNBD system, ACOM software
  • BF STEM detector
  • HAADF STEM detector
  • Electron biprism
  • Digiscan system (Gatan)
  • In-column energy filter
  • LN2 free energy dispersive X-ray SD detector (Bruker)
 
TEM/STEM FEI TITAN 80-300 Image Cs-corrected Cryo-TEM JEOL JEM2100 cryo

Access via
Joint Laboratory for Electron Microscopy Adlershof (JEMA)
in cooperation with
Leibniz Institute for Crystal Growth

Access via
Joint Laboratory for Structural Research (JLSR)
in cooperation with
Helmholtz Centre Berlin and Technical University Berlin
  • 300 kV, field emission gun
  • CEOS image Cs-corrector
  • 2k x 2k camera
  • HAADF STEM detector
  • 200 kV, LaB6 cathode
  • 4k x 4k TVIPS camera
  • Tomography package
  • Cryo transfer of plunge-frozen samples
 
Scanning Electron Microscope
Zeiss GeminiSEM 500
  • NanoVP Option
  • In-lens SE detector
  • In-lens EsB detector
  • BSE 4-Quandrant detector
  • STEM detector
  • Bruker XFlash 6|30 EDX system
  • Raith ELPHY Quantum Lithography system
  • Custom stages for 4D-STEM
 
TEM Sample Preparation

Goal: Fabrication of samples having only some nanometer thickness with as few preparation artifacts as possible.
 
Instrumentation for preparation of hybrid inorganic/organic materials systems and soft matter.

Ultramicrotome cutting

 EM Ultracut 7 (Leica)
 
Instrumentation for conventional TEM preparation of inorganic semiconductors.

Formatting

 Diamond wire saw (Dwell)

Polishing

 Minimet polishing machine (Bühler)

Dimpling

 Dimple grinder (Gatan)
Ion Milling

Rapid etching system RES101 (Baltec)
Ion Milling

Rapid etching system RES010 (Baltec)
Ion Milling

Rapid etching system RES010 (Baltec) - Low Voltage
Ion Milling
Precision ion polishing system (PIPS) (Gatan)
 
Optical Microscope
 
Zeiss Axiovert 200M